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FDS6690A February 2007 FDS6690A Single N-Channel, Logic-Level, PowerTrench(R) MOSFET General Description This N-Channel Logic Level MOSFET is produced using Fairchild Semiconductor's advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain superior switching performance. These devices are well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required. tm Features * 11 A, 30 V. RDS(ON) = 12.5 m @ VGS = 10 V RDS(ON) = 17.0 m @ VGS = 4.5 V * Fast switching speed * Low gate charge * High performance trench technology for extremely low RDS(ON) * High power and current handling capability D D SO-8 D D DD D D 5 6 4 3 2 1 Pin 1 SO-8 G SG S S SS S TA=25oC unless otherwise noted 7 8 Absolute Maximum Ratings Symbol VDSS VGSS ID PD EAS TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed Parameter Ratings 30 20 (Note 1a) Units V V A W mJ C 11 50 2.5 1.0 96 -55 to +150 Power Dissipation for Single Operation Single Pulse Avalanche Energy (Note 1a) (Note 1b) (Note 3) Operating and Storage Junction Temperature Range Thermal Characteristics RJA RJA RJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 1a) (Note 1b) (Note 1) 50 125 25 C/W Package Marking and Ordering Information Device Marking FDS6690A (c)2007 Fairchild Semiconductor Corporation Device FDS6690A Reel Size 13'' Tape width 12mm Quantity 2500 units FDS6690A Rev E1 (W) FDS6690A Electrical Characteristics Symbol BVDSS BVDSS TJ IDSS IGSS VGS(th) VGS(th) TJ RDS(on) TA = 25C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage (Note 2) Test Conditions VGS = 0 V, ID = 250 A Min Typ 30 25 Max Units V mV/C Off Characteristics ID = 250 A, Referenced to 25C VDS = 24 V, VGS = 20 V, VGS = 0 V VDS = 0 V 1 1.9 -5 9.8 12.0 13.7 50 48 1205 290 115 VGS = 15 mV, f = 1.0 MHz (Note 2) 1 10 100 3 A A nA V mV/C VDS = 24 V, VGS = 0 V, TJ=55C On Characteristics Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge ID = 250 A VDS = VGS, ID = 250 A, Referenced to 25C VGS = 10 V, ID = 11 A ID = 10 A VGS = 4.5 V, VGS= 10 V, ID = 11 A, TJ=125C VGS = 10 V, VDS = 5 V, VDS = 15 V, f = 1.0 MHz VDS = 5 V ID = 11 A V GS = 0 V, 12.5 17.0 22.0 m ID(on) gFS Ciss Coss Crss RG td(on) tr td(off) tf Qg Qgs Qgd IS VSD trr Qrr A S pF pF pF 19 10 44 19 16 ns ns ns ns nC nC nC 2.1 0.74 24 27 1.2 A V nS nC Dynamic Characteristics 2.4 9 5 28 9 Switching Characteristics VDD = 15 V, VGS = 10 V, ID = 1 A, RGEN = 6 VDS = 15 V, VGS = 5 V ID = 11 A, 12 3.4 4.0 Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward VGS = 0 V, IS = 2.1 A (Note 2) Voltage Diode Reverse Recovery Time IF = 11 A, diF/dt = 100 A/s Diode Reverse Recovery Charge Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. a) 50C/W when mounted on a 1in2 pad of 2 oz copper b) 125C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2 Test: Pulse Width < 300s, Duty Cycle < 2.0% 3. Starting TJ = 25C, L = 3mH, IAS = 8A, VDD = 30V, VGS = 10V FDS6690A Rev E1 (W) FDS6690A Typical Characteristics 50 VGS = 10V 40 ID, DRAIN CURRENT (A) 3 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 4.0V VGS = 3.0V 2.5 6.0V 4.5V 3.5.V 30 2 3.5V 20 1.5 4.0V 4.5V 6.0V 10V 10 3.0V 1 0 0 0.5 1 1.5 VDS, DRAIN-SOURCE VOLTAGE (V) 2 0.5 0 10 20 30 ID, DRAIN CURRENT (A) 40 50 Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.05 1.8 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE RDS(ON), ON-RESISTANCE (OHM) 1.6 1.4 1.2 1 0.8 0.6 -50 ID = 11.0A VGS = 10V ID = 5.5A 0.04 0.03 0.02 TA = 125 C o TA = 25 C 0.01 o -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (oC) 150 175 0 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) 10 Figure 3. On-Resistance Variation with Temperature. 50 Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 100 IS, REVERSE DRAIN CURRENT (A) VDS = 5V 40 ID, DRAIN CURRENT (A) VGS = 0V 10 1 0.1 0.01 0.001 TA = 125 C o 30 25 C o 20 TA = 125 C 10 o 25 C -55 C o o -55 C o 0 1 1.5 2 2.5 3 VGS, GATE TO SOURCE VOLTAGE (V) 3.5 4 0.0001 0 0.2 0.4 0.6 0.8 1 VSD, BODY DIODE FORWARD VOLTAGE (V) 1.2 Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDS6690A Rev E1 (W) FDS6690A Typical Characteristics 10 1600 ID = 11.0A VDS = 10V 15V f = 1MHz VGS = 0 V VGS, GATE-SOURCE VOLTAGE (V) 8 20V 6 CAPACITANCE (pF) 1200 Ciss 800 4 2 400 Coss Crss 0 0 5 10 15 Qg, GATE CHARGE (nC) 20 25 0 0 5 10 15 20 25 VDS, DRAIN TO SOURCE VOLTAGE (V) 30 Figure 7. Gate Charge Characteristics. 100 Figure 8. Capacitance Characteristics. 100 100 ID, DRAIN CURRENT (A) 10 RDS(ON) LIMIT 100ms 1 VGS = 10V SINGLE PULSE o RJA = 125 C/W TA = 25 C o 1s 10s IAS, AVALANCHE CURRENT (A) 1ms 10ms DC 10 Tj=25 0.1 0.01 0.01 0.1 1 10 VDS, DRAIN-SOURCE VOLTAGE (V) 100 1 0.01 0.1 tAV, TIME IN AVALANCHE (mS) Figure 9. Maximum Safe Operating Area. Figure 10. Unclamped Inductive Switching Capability Figure 50 P(pk), PEAK TRANSIENT POWER (W) 40 30 20 10 0 0.001 0.01 0.1 t 1 , TIME (sec) 1 Figure 11. Single Pulse Maximum Power Dissipation. Tj=125 1 10 100 SINGLE PULSE C/W R JA = 125 TA = 25 C 10 100 FDS6690A Rev E1 (W) FDS6690A Typical Characteristic 1 r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE D = 0.5 0.2 0.1 0.1 0.05 R JA (t) = r(t) * R JA /W R JA = 125 P(pk) t1 t2 SINGLE PULSE 0.02 0.01 0.01 T J - T A = P * R JA (t) Duty Cycle, D = t 1 / t 2 0.001 0.0001 0.001 0.01 0.1 t1, TIME (sec) 1 10 100 1000 Figure 12. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1c. Transient thermal response will change depending on the circuit board design. FDS6690A Rev E1 (W) FDS6690A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACT(R) FAST(R) FASTrTM FPSTM FRFETTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyBoostTM TinyBuckTM TinyPWMTM TinyPowerTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHC(R) UniFETTM VCXTM WireTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I22 Preliminary No Identification Needed Full Production Obsolete Not In Production FDS6690A Rev E1 (W) |
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